Simulation and modeling of the structure and surface profile of sputtered refractory films for VLSI barriers.

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Creator: 

Salahuddin, Mohammad

Date: 

1998

Subject: 

Integrated Circuits -- Very Large Scale Integration -- Computer Simulation
Metallizing
Tungsten
Sputtering (Physics)
Refractory Materials

Language: 

English

Publisher: 

Carleton University

Identifier: 

Proquest Record
Library Catalogue Record
https://doi.org/10.22215/etd/1998-03867

Thesis Degree Name: 

Master of Engineering: 
M.Eng.

Thesis Degree Level: 

Master's

Thesis Degree Discipline: 

Engineering, Electrical

Parent Collection: 

Theses and Dissertations

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